Hitachi, Japan

Masatsugu Ogata

This inventor holds 36 USPTO granted patents, primarily in Semiconductor Devices. Top assignees: Hitachi, Ltd., Hitachi Chemical Company, Ltd., Renesas Technology Corp.. Active years: 1976-2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masatsugu Ogata. Retrieved from https://idiyas.com/inventor/masatsugu-ogata

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 91.7

Average Co-Inventor Count = 9.3

ph-index = 13

Forward Citations = 516(Granted Patents)


Location History:

  • Hitachi, JA (1976)
  • Ibaraki-ken, JP (2003)
  • Hitachi-shi, Ibaragi, JP (2003)
  • Hitachi, JP (1978 - 2005)

Company Filing History:


Years Active: 1976-2005

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Areas of Expertise:
Semiconductor Device
Epoxy Resin
Liquid Aromatic Amine
Multilayer Printed Circuit Board
Stacked High Mounting Density
Resin Composition
Plastic Molded Device
Self-Bondable Insulated Wires
Precision Machinery Component
Dynamoelectric Machine
Resin Encapsulation
Thermosetting Resin
36 patents (USPTO):Explore Patents

Title: Masatsugu Ogata: Innovator in Semiconductor Technology

Introduction

Masatsugu Ogata, based in Hitachi, Japan, is a prominent inventor known for his significant contributions to the field of semiconductor technology. With an impressive portfolio of 36 patents, Ogata has pioneered various innovations that enhance the efficiency and performance of semiconductor devices.

Latest Patents

Ogata's latest patents focus on advanced semiconductor devices. He has addressed the challenges associated with packaging large-sized, highly integrated, and accelerated semiconductor chips. To tackle these difficulties, he introduced the 'Lead-On-Chip' or 'Chip-On-Lead' structure. This innovative package design allows for the stacking and packing of semiconductors and leads in a more efficient manner. Notably, the architecture creates a wider gap between the leading end portions of the inner leads and the semiconductor chip, compared to the gap between the inner lead portions, thus reducing stray capacity, improving signal transmission rates, and minimizing electrical noise.

Career Highlights

Throughout his career, Ogata has worked at renowned companies, including Hitachi, Ltd. and Hitachi Chemical Company, Ltd. His experience in these organizations has played a pivotal role in shaping his expertise and driving his innovations forward.

Collaborations

In his pursuit of advancements in semiconductor technology, Ogata has collaborated with notable coworkers, such as Masanori Segawa and Hiroyoshi Kokaku. Their combined efforts in research and development have significantly contributed to the progress of the semiconductor industry.

Conclusion

Masatsugu Ogata's innovative spirit and dedication to technological advancements have established him as a leading figure in semiconductor innovation. His contributions, particularly in packaging technology, continue to influence the performance and integration of electronic devices. With his track record of patents and collaborations, Ogata remains a key player in the evolution of semiconductor technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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