Masataka Hoshino

Title: Masataka Hoshino: Innovator in Semiconductor Technology

Introduction

Masataka Hoshino is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work focuses on improving the reliability and efficiency of semiconductor devices.

Latest Patents

Hoshino's latest patents include a semiconductor device with a via hole of uneven width. This invention offers a semiconductor device with improved reliability and its manufacturing method. The device consists of a semiconductor substrate, a pad electrode formed on the substrate through an insulation layer made of materials such as silicon oxide or silicon nitride. A supporting plate is bonded to the top surface of the semiconductor substrate to cover the pad electrode. The via hole extends from the back surface of the substrate to the pad electrode, with an aperture that is larger near the pad electrode than at the back surface. Another patent focuses on a semiconductor device and its manufacturing method, reiterating the same innovative features that enhance reliability.

Career Highlights

Throughout his career, Hoshino has worked with notable companies such as Fujitsu Corporation and Sanyo Electric Co., Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Hoshino has collaborated with esteemed colleagues, including Mitsuo Umemoto and Hiroshi Terao. These partnerships have fostered a collaborative environment that has led to advancements in semiconductor devices.

Conclusion

Masataka Hoshino's contributions to semiconductor technology are noteworthy, with a focus on enhancing device reliability through innovative designs. His patents reflect a commitment to advancing the field, making him a significant figure in the industry.