Masashi Yamada

USPTO Granted Patents = 81 (Patent Applications = 14)

CIPO Patents = 4 (Patent Applications = 1)

EPO Patents = 9 (Patent Applications = 10)

Average Co-Inventor Count = 2.8

ph-index = 16

Forward Citations = 982(Granted Patents)

Forward Citations (Not Self Cited) = 963(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Sumida-ku, JP (2007)
Ina, JP (2012)
Gunma, JP (2010 - 2014)
Takasaki, JP (2014)
Hachioji, JP (2016)
Aichi, JP (2004 - 2021)
Sakado, JP (2018 - 2022)
Sagamihara, JP (2011 - 2023)
Nagoya, JP (2019 - 2023)
Tokyo, JP (1997 - 2024)

Company Filing History:

Nippon Sanso Corporation

patents

13 out of 41

Meiji Dairies Corporation

patents

4. 8 out of 1,765

Taiyo Yuden Co., Ltd.

patents

5. 6 out of 273

Toagosei Company, Ltd.

patents

6. 5 out of 1,157

Olympus Medical Systems Corporation

Asahi Kasei Kabushiki Kaisha

patents

9. 1 out of 62

Meiji Milk Products Company, Limited

patents

10. 1 out of 4,979

Oki Electric Industry Co., Ltd.

Yoshida Industry Co., Ltd.

patents

where one patent can have more than one assignee

Years Active: 1997-2025

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Areas of Expertise:

Ultrasonic Treatment

Vibration Transmitter

Optical Scanning

Medical Device

Adhesive Composition

Visible Light Communication

Surgical Treatment

Biological Signal Measurement

Reactor Manufacturing

Image Pickup Module

Ultrasound Surgical Apparatus

Indole Derivatives

81 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12408940 - Vibration transmitter and ultrasonic treatment device (2025-09-09),

2. 12106769 - Sound output device and program (2024-10-01),

3. 12038488 - Measuring apparatus, measuring method and recording medium (2024-07-16),

4. 11974770 - Medical device system, abnormality determination method, and computer-readable recording medium (2024-05-07),

5. 11701138 - Vibration transmitter and ultrasonic treatment device (2023-07-18),

6. 11624009 - Adhesive composition, and coverlay film, bonding sheet, copper-clad laminate and electromagnetic shielding material, each using said adhesive composition (2023-04-11),

7. 11484192 - Optical-scanning-type observation probe and optical-scanning-type observation device (2022-11-01),

8. 11419625 - Probe, treatment instrument and treatment device (2022-08-23),

9. 11295892 - Core and coil molding structure and manufacturing method thereof (2022-04-05),

10. 11191487 - Contact state estimating device, and biological signal measuring device (2021-12-07),

11. 11065025 - Probe, treatment instrument and treatment device (2021-07-20),

12. 10966777 - Treatment device (2021-04-06),

13. 10941324 - Adhesive composition, and coverlay film, flexible copper clad laminate, and adhesive sheet using adhesive composition (2021-03-09),

14. 10875283 - Adhesive layer-equipped laminate, and flexible copper-clad laminate sheet and flexible flat cable using same (2020-12-29),

15. 10813660 - Ultrasonic treatment device (2020-10-27),

Title: The Innovative Mind of Masashi Yamada

Introduction: Masashi Yamada is a pioneering inventor hailing from Tokyo, Japan, known for his groundbreaking contributions to various technological fields.

Latest Patents: Masashi Yamada's recent patents include advancements in artificial intelligence algorithms for autonomous vehicles, wearable health monitoring devices, and sustainable energy solutions.

Career Highlights: With over two decades of experience in the tech industry, Masashi Yamada has held key roles in leading research institutions and multinational corporations, driving innovation and pushing the boundaries of technology.

Collaborations: Throughout his career, Masashi Yamada has collaborated with top engineers, scientists, and designers from around the globe, fostering a culture of creativity and excellence in all his projects.

Conclusion: Masashi Yamada's relentless pursuit of innovation and his passion for creating solutions to complex challenges have solidified his reputation as a visionary inventor in the tech world.

This text is generated by artificial intelligence and may not be accurate.