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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10875283 B1

PDFFull Text
Date of Patent:
Dec. 29, 2020

Filed:

Jul. 21, 2015

Adhesive layer-equipped laminate, and flexible copper-clad laminate sheet and flexible flat cable using same

Applicant:

Toagosei Co., Ltd., Tokyo, JP;

Inventors:

Yuya Okimura, Nagoya, JP;

Masashi Yamada, Nagoya, JP;

Assignee:

TOAGOSEI CO., LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, LLP

Primary Examiner:

Megan McCulley

Int. Cl.
CPC ...
B32B 27/38 (2006.01); C09J 163/00 (2006.01); B32B 27/00 (2006.01); B32B 25/08 (2006.01); B32B 15/08 (2006.01); C09J 125/06 (2006.01); C08L 63/00 (2006.01); C09J 7/35 (2018.01); H05K 3/38 (2006.01); C09J 153/02 (2006.01); C08L 53/02 (2006.01); C08L 25/06 (2006.01); B32B 15/12 (2006.01); B32B 27/28 (2006.01); B32B 27/34 (2006.01); B32B 27/10 (2006.01); B32B 15/085 (2006.01); B32B 15/20 (2006.01); B32B 15/09 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01); B32B 15/088 (2006.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 27/32 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/02 (2006.01); C09J 125/10 (2006.01);
U.S. Cl.
CPC ...
B32B 27/38 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/085 (2013.01); B32B 15/088 (2013.01); B32B 15/09 (2013.01); B32B 15/12 (2013.01); B32B 15/20 (2013.01); B32B 25/08 (2013.01); B32B 27/00 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/28 (2013.01); B32B 27/281 (2013.01); B32B 27/286 (2013.01); B32B 27/288 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); C08L 25/06 (2013.01); C08L 53/025 (2013.01); C08L 63/00 (2013.01); C09J 7/35 (2018.01); C09J 125/06 (2013.01); C09J 153/025 (2013.01); C09J 163/00 (2013.01); H05K 1/028 (2013.01); H05K 1/0353 (2013.01); H05K 1/09 (2013.01); H05K 3/386 (2013.01); B32B 2255/10 (2013.01); B32B 2255/12 (2013.01); B32B 2255/26 (2013.01); B32B 2307/204 (2013.01); B32B 2307/546 (2013.01); B32B 2307/732 (2013.01); B32B 2307/748 (2013.01); B32B 2309/105 (2013.01); B32B 2457/08 (2013.01); C09J 125/10 (2013.01); C09J 2203/326 (2013.01); C09J 2301/414 (2020.08); C09J 2400/163 (2013.01); C09J 2425/00 (2013.01); C09J 2453/00 (2013.01); C09J 2463/00 (2013.01); C09J 2479/086 (2013.01); H05K 3/022 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0158 (2013.01);
Abstract

A laminate having an adhesive layer, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and also providing a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in B stage, and which is excellent in storage stability of the laminate. The laminate having an adhesive layer includes a base film and an adhesive layer formed on at least one of the surfaces of the base film, in which the adhesive layer is formed of an adhesive composition comprising a carboxyl group-containing styrene based elastomer and an epoxy resin, wherein the content of the carboxyl group-containing styrene based elastomer is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the carboxyl group-containing styrene based elastomer; and the adhesive layer is in B-stage.

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