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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10941324 B1

PDFFull Text
Date of Patent:
Mar. 09, 2021

Filed:

Jul. 03, 2017

Adhesive composition, and coverlay film, flexible copper clad laminate, and adhesive sheet using adhesive composition

Applicant:

Toagosei Co., Ltd., Tokyo, JP;

Inventors:

Makoto Hirakawa, Aichi, JP;

Masashi Yamada, Aichi, JP;

Anna Sekioka, Tokyo, JP;

Assignee:

TOAGOSEI CO., LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, LLP

Primary Examiner:

Nicholas E Hill

Int. Cl.
CPC ...
C09J 177/00 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); C09J 11/06 (2006.01); C09J 163/00 (2006.01); B32B 27/20 (2006.01); H05K 1/03 (2006.01); B32B 27/00 (2006.01); C09J 177/06 (2006.01); H05K 3/28 (2006.01); C09J 177/08 (2006.01); B32B 27/38 (2006.01); B32B 27/34 (2006.01); C09J 11/04 (2006.01); C08K 5/544 (2006.01);
U.S. Cl.
CPC ...
C09J 177/00 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/00 (2013.01); B32B 27/20 (2013.01); B32B 27/34 (2013.01); B32B 27/38 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 163/00 (2013.01); C09J 177/06 (2013.01); C09J 177/08 (2013.01); H05K 1/03 (2013.01); H05K 3/28 (2013.01); B32B 2311/12 (2013.01); B32B 2379/08 (2013.01); C08K 5/5442 (2013.01); C09J 2467/005 (2013.01); C09J 2479/086 (2013.01);
Abstract

An adhesive composition is provided which exhibits not only adhesiveness to a polyimide film or copper foil, but also high adhesiveness to gold-plated copper foil, and is also superior in heat resistance such as soldering heat resistance. The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25° C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).

Find Patent Forward Citations

Quick Actions:

Hirakawa, Makoto. (2021). Adhesive composition, and coverlay film, flexible copper clad laminate, and adhesive sheet using adhesive composition (U.S. Patent No. 10941324). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10941324

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