This inventor holds 1 USPTO granted patent. Top assignee: Toagosei Company, Ltd.. Active years: 2021.
Company Filing History:
Years Active: 2021
Title: Innovations by Anna Sekioka
Introduction
Anna Sekioka is a prominent inventor based in Tokyo, Japan. She has made significant contributions to the field of adhesive compositions, particularly in applications involving polyimide films and copper foils. Her innovative work has led to the development of a unique adhesive composition that exhibits exceptional properties.
Latest Patents
Anna holds a patent for an adhesive composition, coverlay film, flexible copper clad laminate, and adhesive sheet using the adhesive composition. This invention provides an adhesive that not only adheres well to polyimide film and copper foil but also demonstrates high adhesiveness to gold-plated copper foil. Additionally, it showcases superior heat resistance, including soldering heat resistance. The adhesive composition consists of a solvent-soluble polyamide resin, an epoxy resin, and an imidazole compound with an alkoxysilyl group, with specific mass ratios and content for optimal performance.
Career Highlights
Anna Sekioka is currently employed at Toagosei Company, Ltd., where she continues to innovate and develop new adhesive technologies. Her work has been instrumental in advancing the capabilities of adhesive materials in various applications.
Collaborations
Anna collaborates with notable colleagues, including Makoto Hirakawa and Masashi Yamada. Their combined expertise contributes to the success of their projects and the advancement of adhesive technology.
Conclusion
Anna Sekioka's contributions to adhesive compositions highlight her innovative spirit and dedication to advancing technology in her field. Her patent reflects her commitment to creating high-performance materials that meet the demands of modern applications.