Kyoto, Japan

Masao Takahashi

This inventor holds 20 USPTO granted patents, primarily in Semiconductor Technology. Top assignees: Panasonic Corporation, Matsushita Electric Industrial Co., Ltd., Medivas, LLC. Active years: 1991-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masao Takahashi. Retrieved from https://idiyas.com/inventor/masao-takahashi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 95.0

Average Co-Inventor Count = 4.0

ph-index = 6

Forward Citations = 285(Granted Patents)


Location History:

  • Chigasake, JP (2002)
  • Gunma-ken, JP (2003 - 2004)
  • Chigasaki, JP (1991 - 2006)
  • Takatsuki, JP (2007)
  • Kyoto, JP (2009 - 2014)
  • Osaka, JP (2014)

Company Filing History:


Years Active: 1991-2014

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Areas of Expertise:
Semiconductor Device
Interconnects
Fabrication Method
Power Supply Noise
Integrated Circuit
Testing Method
Perfusion System
Liquid Waste Disposal
Treatment Site Stabilization
Mobile Communication Antenna
Voltage-Controlled Oscillator
Surface Elastic Wave Resonator
20 patents (USPTO):Explore Patents

Title: **Masao Takahashi: Innovator in Semiconductor Technology**

Introduction

Masao Takahashi, hailing from Kyoto, Japan, is a distinguished inventor known for his significant contributions to semiconductor technology. With an impressive portfolio of 20 patents, Takahashi has made a lasting impact on the electronic materials and devices industry.

Latest Patents

Takahashi's latest inventions showcase his ingenuity in semiconductor design. One of his recent patents is for a **semiconductor device having a pad and plurality of interconnects**. This invention involves a semiconductor substrate with a first interlayer insulating film formed on top. Above this film, a pad is situated, where a plurality of first interconnects are designed in unique quadrangular shapes, enhancing the overall functionality of the device.

Another notable patent is for a **semiconductor device** that features electrode pads arranged in a zigzag pattern across two or more rows. In this innovative design, the lead interconnect, which connects another electrode pad to an internal circuit, is ingeniously placed directly under the non-probe region rather than the probe region, facilitating better performance and reliability.

Career Highlights

During his illustrious career, Masao Takahashi has worked with prestigious companies, including Panasonic Corporation, where he honed his skills and contributed to groundbreaking advancements in semiconductor technology. His journey is characterized by a relentless pursuit of innovation and excellence.

Collaborations

Throughout his career, Takahashi has collaborated with talented colleagues such as Koji Takemura and Hikari Sano. These partnerships have enabled him to push the boundaries of technology and achieve significant milestones within the semiconductor field.

Conclusion

Masao Takahashi stands as a prominent figure in the realm of semiconductor innovations. His 20 patents reflect his dedication to enhancing electronic devices' efficiency and capability, solidifying his legacy as an influential inventor. Through his work, he continues to inspire future generations of innovators in the field of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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