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Yokohama, Japan

Masanori Shindo

USPTO Granted Patents = 9

Average Co-Inventor Count = 1.0

ph-index = 1

Location History:

Yokohama, JP (2018 - 2023)
Miyazaki, JP (2021 - 2023)
Kanagawa, JP (2022 - 2023)

Company Filing History:

Lapis Semiconductor Co., Ltd.

Years Active: 2018-2024

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9 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12094824 - Semiconductor package and method for manufacturing semiconductor package (2024-09-17),

2. 11742305 - Semiconductor device and manufacturing method of semiconductor device (2023-08-29),

3. 11664314 - Semiconductor package and method for manufacturing semiconductor package (2023-05-30),

4. 11600589 - Semiconductor device and semiconductor device manufacturing method (2023-03-07),

5. 11545452 - Semiconductor device bonding area including fused solder film and manufacturing method (2023-01-03),

6. 11538775 - Semiconductor device and method of manufacturing a semiconductor device (2022-12-27),

7. 11004813 - Semiconductor device and manufacturing method of semiconductor device (2021-05-11),

8. 10910331 - Semiconductor device bonding area including fused solder film and manufacturing method (2021-02-02),

9. 10141279 - Semiconductor device and manufacturing method for semiconductor device (2018-11-27),

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