Yokohama, Japan

Masanori Shindo

This inventor holds 9 USPTO granted patents. Top assignee: Lapis Semiconductor Co., Ltd.. Active years: 2018-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masanori Shindo. Retrieved from https://idiyas.com/inventor/masanori-shindo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1


Location History:

  • Yokohama, JP (2018 - 2023)
  • Miyazaki, JP (2021 - 2023)
  • Kanagawa, JP (2022 - 2023)

Company Filing History:


Years Active: 2018-2024

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9 patents (USPTO):Explore Patents

Title: The Innovations of Masanori Shindo

Introduction

Masanori Shindo is a prominent inventor based in Yokohama, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work focuses on innovative methods for manufacturing semiconductor packages and devices, which are crucial for modern electronics.

Latest Patents

Shindo's latest patents include a groundbreaking semiconductor package and a method for manufacturing it. This invention involves a foundation portion and a conductive base portion that are formed on a temporary support. A semiconductor element is electrically connected to the base portion and is disposed on one side of the temporary support. An insulating layer is then formed to encase the foundation portion, base portion, and semiconductor element. After removing the temporary support, the exposed foundation portion is further removed, allowing the base portion to be recessed below the insulating layer's surface. An external connection terminal is then formed on the exposed base portion, completing the semiconductor package.

Another notable patent is for a semiconductor device that includes a lower insulating layer on a semiconductor substrate's primary surface. A sealing layer is formed in contact with the top surface of this insulating layer. The device features a conductive member with a first conductive member on the sealing layer, which has a specific film thickness, and a second conductive member that is smaller in thickness and in contact with the first. This innovative design enhances the performance and reliability of semiconductor devices.

Career Highlights

Masanori Shindo is currently associated with Lapis Semiconductor Co., Ltd., where he continues to push the boundaries of semiconductor technology. His expertise and innovative mindset have made him a valuable asset to the company and the industry as a whole.

Collaborations

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Conclusion

Masanori Shindo's contributions to semiconductor technology through his patents and innovative methods have significantly impacted the field. His work continues to inspire advancements in electronics and semiconductor manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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