The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2022
Filed:
Feb. 01, 2021
Applicant:
Lapis Semiconductor Co., Ltd., Kanagawa, JP;
Inventor:
Masanori Shindo, Kanagawa, JP;
Assignee:
LAPIS SEMICONDUCTOR CO., LTD., Yokohama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/02 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/13024 (2013.01);
Abstract
A semiconductor device includes wiring that is formed by a conductive body extending, via an insulating film, on a front surface of a semiconductor substrate, and an insulating layer that covers the front surface of the semiconductor substrate including the wiring. Gaps are provided extending from an upper surface of the wiring to a lower portion of the insulating film.