Masanobu Shoji

Title: Masanobu Shoji: Semiconductor Packaging and Lead-Frame Innovations.

Introduction

Masanobu Shoji is an inventor associated with Tsuruoka, Japan, and Seiko Epson Corporation. His patent work focuses on semiconductor packaging, including lead-frame structures and substrates for fixing integrated circuit elements. He is credited with 4 patents.

Latest Patents

One of Shoji’s latest patent disclosures, “Lead Frame, Lead Frame Fabrication, and Semiconductor Device,” addresses defects that can arise during semiconductor-device fabrication, particularly connection defects in wire bonding. The described approach forms a substrate with a convex portion and a metal layer, then bends part of the layer so it overlaps another surface of the convex portion. The invention aims to improve product yield and reliability.

Another disclosure, “Substrate and Manufacturing Method of the Same, and Semiconductor Device and Manufacturing Method of the Same,” describes a substrate for fixing an integrated circuit element. It includes metal columns arranged in longitudinal and lateral directions, joined by connecting parts between their opposing faces. A recognition mark on one column’s face supports identification during manufacturing.

Career Highlights

Shoji’s disclosed inventions address practical challenges in semiconductor production. His work on lead frames and integrated-circuit substrates emphasizes reducing manufacturing defects, supporting accurate processing, and improving the reliability of semiconductor devices.

Collaborations

Shoji is associated with Seiko Epson Corporation. His listed coworkers include Toru Fujita and Shiro Sato.

Conclusion

Masanobu Shoji’s patent work reflects a focus on semiconductor packaging and manufacturing methods designed to improve production quality and device reliability.