The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7807498 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 05, 2010

Filed:

Jul. 10, 2008
Applicants:

Masanobu Shoji, Tsuruoka, JP;

Toru Fujita, Tsuruoka, JP;

Inventors:

Masanobu Shoji, Tsuruoka, JP;

Toru Fujita, Tsuruoka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A substrate for fixing an integrated circuit (IC) element comprises: a substrate for fixing an integrated circuit element includes: a plurality of metal posts that are aligned in a longitudinal direction and a lateral direction in plan view, each of the plurality of metal posts having a first surface and a second surface facing an opposite direction to the first surface, the plurality of metal posts being configured identically; and a joining section that joins each of the plurality of metal posts together at a portion of each of the plurality of metal posts between the first surface and the second surface.


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Shoji, Masanobu. (2010). Substrate, substrate fabrication, semiconductor device, and semiconductor device fabrication (U.S. Patent No. 7807498). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7807498

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