The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7875988 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 25, 2011

Filed:

Jul. 07, 2008
Applicants:

Masanobu Shoji, Tsuruoka, JP;

Toru Fujita, Tsuruoka, JP;

Inventors:

Masanobu Shoji, Tsuruoka, JP;

Toru Fujita, Tsuruoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
Abstract

A substrate for fixing an integrated circuit element includes: a plurality of metal columns that are aligned in a longitudinal direction and a lateral direction in a planar view, each of the plurality of metal columns having a first face and a second face facing opposite direction to the first face; and a connecting part that connects the plurality of metal columns one another at a part of each of the plurality of metal columns between the first face and the second face. In the substrate, a recognition mark is formed on the first face of one of the plurality of metal columns.


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Shoji, Masanobu. (2011). Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same (U.S. Patent No. 7875988). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7875988

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