The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7608479 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 27, 2009

Filed:

Jan. 17, 2006
Applicants:

Hirohisa Nakayama, Sakata, JP;

Shiro Sato, Tsuruoka, JP;

Masanobu Shoji, Tsuruoka, JP;

Hitoshi Nosaka, Tsuruoka, JP;

Inventors:

Hirohisa Nakayama, Sakata, JP;

Shiro Sato, Tsuruoka, JP;

Masanobu Shoji, Tsuruoka, JP;

Hitoshi Nosaka, Tsuruoka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a semiconductor device includes: applying a paste containing acid to an electrical connection section which is electrically connected with a semiconductor substrate; removing the paste from the electrical connection section by washing the electrical connection section; and providing a conductive material to the electrical connection section.


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Nakayama, Hirohisa. (2009). Method of manufacturing semiconductor device and method of treating electrical connection section (U.S. Patent No. 7608479). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7608479

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