Masamichi Harada

Title: Masamichi Harada: Innovator in Semiconductor Technology

Introduction

Masamichi Harada is a prominent inventor based in Shizuoka, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His innovative approaches have advanced the manufacturing processes of semiconductor devices.

Latest Patents

One of Harada's latest patents is a method for forming a Cu electrical interconnection film. This method utilizes an adhesive layer that enhances the adhesion between the Cu electrical interconnection film and the substrate during semiconductor device manufacturing. The process involves forming a barrier film on a substrate, followed by the deposition of a Co film and subsequently filling the hole with a Cu film. Heat treatment is then applied at a temperature of 350°C or below to complete the formation of the Cu electrical interconnection film. Another notable patent is a barrier film producing method for semiconductors. This method introduces a metallic material gas and a reactive gas into a vacuum chamber, producing radicals that facilitate the formation of a barrier film without degrading the catalytic material.

Career Highlights

Throughout his career, Masamichi Harada has worked with notable companies such as Ulvac, Inc. and Nihon Shinku Gijutsu Kabushiki Kaisha. His work has been instrumental in developing advanced technologies that enhance semiconductor manufacturing processes.

Collaborations

Harada has collaborated with esteemed colleagues, including Narishi Gonohe and Nobuyuki Kato. These partnerships have contributed to the successful development of innovative solutions in the semiconductor industry.

Conclusion

Masamichi Harada's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in semiconductor manufacturing processes.