Masako Watase

Title: Masako Watase: Semiconductor Polishing Inventions

Introduction

Masako Watase is an inventor associated with Yokohama, Japan. Her patent work includes semiconductor wafer polishing and processing equipment. She is credited with 5 patents.

Latest Patents

Watase’s listed patents describe polishing systems designed to polish a workpiece and then clean it in a separate chamber.

“Polishing apparatus” describes a housing divided by a partition wall into polishing and cleaning chambers. In the polishing chamber, a turntable fitted with abrasive cloth works with a top ring that holds and presses the workpiece against the cloth. A transfer device moves the polished workpiece through an opening to the cleaning chamber. Separate exhaust systems independently remove ambient air from each chamber.

“Polishing apparatus and a method of polishing and cleaning and drying a wafer” describes a similar arrangement for processing a wafer. Its design separates polishing from cleaning and uses independent exhaust systems for the two chambers, supporting distinct environments for each stage.

Career Highlights

Watase’s listed professional affiliations include Toshiba Corporation and Ebara Corporation. Her patent descriptions focus on equipment that integrates wafer polishing and subsequent cleaning while keeping the processing areas separate.

Collaborations

Her listed coworkers include Shiro Mishima and Shoichi Kodama.

Conclusion

Masako Watase’s patent portfolio reflects work on semiconductor processing equipment, particularly systems that combine wafer polishing and cleaning in separately controlled chambers.