Kabushiki Kaisha Toshiba

Ebara Corporation

Other

Masako Watase

Shiro Mishima

Tetsuji Togawa

Manabu Tsujimura

Atsushi Shigeta

Hiromi Yajima

Toyomi Nishi

Shoichi Kodama

Riichiro Aoki

Yukio Imoto

Harumitsu Saito

Gisuke Kouno

Kazuaki Himukai

Norio Kimura

Koji Saito

Hozumi Yasuda

You Ishii

A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

Polishing apparatus

Polishing apparatus and a method of polishing and cleaning and drying a wafer

Polishing apparatus and method

Polishing aparatus and method

A polishing apparatus for polishing a surface of an object such as a semiconductor wafer includes a turntable having a polishing cloth mounted on an upper surface thereof, a top ring for holding and pressing the object against the polishing cloth, and a plurality of radially arranged nozzles for supplying a polishing solution, containing abrasive material, of different concentrations that differ along a radial direction of the polishing cloth.

Growing community of inventors

Yokohama, Japan

Masako Watase