Tokyo, Japan

Masachika Yoshino


Average Co-Inventor Count = 2.7

ph-index = 8

Forward Citations = 204(Granted Patents)


Location History:

  • Gunma, JP (1988 - 1993)
  • Usui, JP (1996)
  • Usui-gun, JP (2000)
  • Annaka, JP (1989 - 2005)
  • Aichi-ken, JP (2005)
  • Gunma-ken, JP (2000 - 2006)
  • Tokyo, JP (2004 - 2008)

Company Filing History:


Years Active: 1988-2008

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18 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Masachika Yoshino

Introduction

Masachika Yoshino is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of adhesive technologies, holding a total of 18 patents. His work focuses on developing advanced materials that enhance the performance and reliability of electronic components.

Latest Patents

Yoshino's latest patents include a conductive adhesive composition and a wafer dicing/die bonding sheet. The conductive adhesive composition is created by mixing a binder resin with 30-98 wt % of silver powder, which serves as a conductive agent. This innovative composition results in a product that exhibits improved conductivity, adhesion, heat resistance, moisture resistance, and ease of working. The wafer dicing/die bonding sheet consists of a backing member, an adhesive layer, and a protective member. The adhesive layer is formulated with a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent. This combination provides heat resistance and enhanced adhesive properties, effectively reducing chip warpage after die bonding.

Career Highlights

Masachika Yoshino is currently employed at Shin-Etsu Chemical Co., Ltd., where he continues to push the boundaries of adhesive technology. His innovative work has positioned him as a key figure in the industry, contributing to advancements that benefit various applications in electronics.

Collaborations

Yoshino has collaborated with notable coworkers, including Toshio Shiobara and Yoshio Inoue. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Masachika Yoshino's contributions to adhesive technology are noteworthy, with a focus on enhancing the performance of electronic components. His innovative patents and collaborations reflect his commitment to advancing the field.

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