The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2000
Filed:
Apr. 03, 1998
Applicant:
Inventors:
Assignee:
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C / ;
U.S. Cl.
CPC ...
148432 ; 148279 ; 148282 ; 148687 ; 148433 ; 148434 ; 148435 ; 428547 ; 428674 ; 4272551 ; 427399 ;
Abstract
A corrosion-resistant copper material has a surface layer of a copper alloy containing 10-50 at % (i.e. % by atom) of silicon and of 10-1,000 .ANG. thick. It is produced simply by annealing a copper material containing 0.01-5 at % of silicon at 100-600.degree. C. in a hydrogen-containing gas. Because of its excellent resistance to surface corrosion due to heat and aging, the resulting copper material lends itself well to automotive and electrical applications requiring heat resistance, and is also suitable for use in electrical wire and in leadframes for semiconductor devices.