The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2006
Filed:
Nov. 17, 2003
Toshio Shiobara, Usui-gun, JP;
Nobuhiro Ichiroku, Usui-gun, JP;
Hideki Akiba, Usui-gun, JP;
Masachika Yoshino, Tokyo, JP;
Toshio Shiobara, Usui-gun, JP;
Nobuhiro Ichiroku, Usui-gun, JP;
Hideki Akiba, Usui-gun, JP;
Masachika Yoshino, Tokyo, JP;
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Abstract
In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing/die bonding sheet is effective for reducing the warpage of a chip after die bonding.