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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6084037 B1

PDFFull Text
Date of Patent:
Jul. 04, 2000

Filed:

Dec. 18, 1997

Epoxy resin composition and semiconductor device

Applicant:
Inventors:

Hisashi Shimizu, Usui-gun, JP;

Minoru Takei, Usui-gun, JP;

Masachika Yoshino, Usui-gun, JP;

Toshio Shiobara, Usui-gun, JP;

Assignee:

Shin -Etsu Chemical Co., Ltd., , JP;

Attorney:

Millen, White, Zelano & Branigan, P.C.

Primary Examiner:

Robert Dawson

Assistant Examiner:

Jeffrey B Robertson

Int. Cl.
CPC ...
C08F / ;
U.S. Cl.
CPC ...
525476 ; 523443 ; 523453 ; 523456 ; 524 86 ; 524251 ; 528 90 ; 528 94 ; 528109 ; 528114 ; 528374 ;
Abstract

In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, there are blended a salt of trimellitic anhydride with 1,8-diazabicyclo(5.4.0)undecene-7 as a curing accelerator and a mercapto-containing silane coupling agent. The composition is shelf stable and smoothly flowing and cures into a product having improved adhesion, moisture resistance and electrical properties. The composition is suitable for the encapsulation of semiconductor devices.

Find Patent Forward Citations

Shimizu, Hisashi. (2000). Epoxy resin composition and semiconductor device (U.S. Patent No. 6084037). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6084037

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