The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2000
Filed:
Dec. 18, 1997
Applicant:
Inventors:
Hisashi Shimizu, Usui-gun, JP;
Minoru Takei, Usui-gun, JP;
Masachika Yoshino, Usui-gun, JP;
Toshio Shiobara, Usui-gun, JP;
Assignee:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F / ;
U.S. Cl.
CPC ...
525476 ; 523443 ; 523453 ; 523456 ; 524 86 ; 524251 ; 528 90 ; 528 94 ; 528109 ; 528114 ; 528374 ;
Abstract
In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, there are blended a salt of trimellitic anhydride with 1,8-diazabicyclo(5.4.0)undecene-7 as a curing accelerator and a mercapto-containing silane coupling agent. The composition is shelf stable and smoothly flowing and cures into a product having improved adhesion, moisture resistance and electrical properties. The composition is suitable for the encapsulation of semiconductor devices.