Marvin Young Paik

Title: Inventor Spotlight: Marvin Young Paik

Introduction

Marvin Young Paik is a notable inventor based in Portland, Oregon. With three patents to his name, he has made significant contributions to the field of technology and engineering.

Latest Patents

One of Marvin's latest patents focuses on a via contact patterning method that increases the edge placement error margin. This innovative method involves the provision of a pattern of alternating trench contacts and gates over a support structure. Each pair of adjacent trench contacts and gates is physically insulated by dielectric materials or a combination of different dielectric layers. The gates are strategically recessed concerning the trench contacts. To enhance the manufacturing process, a protective layer of dielectric materials and a sacrificial helmet material is wrapped around the trench contacts. This protective measure ensures the integrity of the trench contacts during the patterning and etch processes, ultimately improving the precision of forming via contacts in metallization stacks.

Career Highlights

Marvin is currently employed at Intel Corporation, a global leader in technology and semiconductor manufacturing. His work has positioned him as a key contributor to innovative solutions in the tech industry.

Collaborations

Throughout his career, Marvin has collaborated with notable colleagues, including Mohit K. Haran and Charles Henry Wallace. Their teamwork and collective expertise have driven advancements in their projects and the field, enhancing the impact of their innovations.

Conclusion

Marvin Young Paik is an esteemed inventor whose work continues to influence technology development. His recent patented inventions demonstrate a commitment to improving manufacturing processes and enhancing precision in the industry. As he collaborates with talented peers at Intel Corporation, the future holds exciting possibilities for continued innovation.