Oberhaching, Germany

Markus Höhn

This inventor holds 2 USPTO granted patents. Top assignee: Atotech Deutschland Gmbh. Active years: 2005-2011.


Average Co-Inventor Count = 5.8

ph-index = 2

Forward Citations = 41(Granted Patents)


Company Filing History:


Years Active: 2005-2011

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2 patents (USPTO):Explore Patents

Title: Innovations of Markus Höhn in Micro-Structured Cooling Technology

Introduction

Markus Höhn is a notable inventor based in Oberhaching, Germany. He has made significant contributions to the field of cooling technology, particularly through his innovative designs for micro-structured coolers. With a total of 2 patents to his name, his work focuses on enhancing the efficiency of cooling systems for electronic components.

Latest Patents

Höhn's latest patents include a "Micro-structured cooler and use thereof" and a "Microstructure cooler and use thereof." The first patent proposes a design for a highly efficient micro-structured cooler intended for cooling electronic components. This design involves a stack of at least two metal foils that contain channels for coolant, along with a base plate that ensures thermal contact with the electronic component. The specifications detail the dimensions of the channels and the base plate, emphasizing the precision required for optimal performance. The second patent also focuses on a microstructure cooler, highlighting the importance of material fit and the specific dimensions of the channels and base plate to achieve effective cooling.

Career Highlights

Markus Höhn is currently employed at Atotech Deutschland GmbH, where he continues to develop innovative cooling solutions. His work at Atotech has positioned him as a key player in the advancement of micro-structured cooling technologies.

Collaborations

Höhn collaborates with talented colleagues such as Olaf Kurtz and Peter Prechtl, contributing to a dynamic team environment that fosters innovation and creativity in their projects.

Conclusion

Markus Höhn's contributions to micro-structured cooling technology demonstrate his commitment to advancing the efficiency of cooling systems for electronic components. His patents reflect a deep understanding of the technical requirements necessary for effective thermal management.

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