Atotech Deutschland Gmbh

Markus Höhn

Olaf Kurtz

Ralph Herber

Sven Theisen

Peter Prechtl

Heinrich Meyer

Konrad Cramer

For providing a particularly efficient micro-structured cooler intended more specifically for cooling electronic components, it is proposed to proceed in the following manner to build this cooler: providing a stack of at least two metal foils () comprising channels () for coolant and one base plate () adapted to be brought into thermal contact with the electronic component () through a thermal contact surface (), said metal foils () and said base plate () being joined together so as to form a single piece of material, said channels () having a width b ranging from 100 to 350 &#x3bc;m, a depth t ranging from 30 to 150 &#x3bc;m, a mean spacing s ranging from 30 to 300 &#x3bc;m, residual foil thickness r remaining after formation of the channels () in the metal foils () ranging from 30 to 300 &#x3bc;m and said base plate () having a thickness g ranging from 100 to 1,000 &#x3bc;m.

Micro-structured cooler and use thereof

The invention relates to a microstructure coolerfor an articleto be cooled, whereby the coolerincludes a stack of at least two metal filmsand one base platethat can be brought via a thermal contact surfaceinto thermal contact with the article, the metal filmsand the base plateare joined to one another in a material fit, present in the metal filmsare channelsfor cooling medium, and the channelshave a width in the range of 100 to 2,000 &#x3bc;m, a depth in the range of 25 to 1,000 &#x3bc;m, and a mean interval in the range of 50 to 1,000, residual film thicknesses resulting from the channelsin the metal filmsare in the range of 50 to 300 &#x3bc;m, and the base platehas a thickness in the range of 200 to 2,000 &#x3bc;m.

Microstructure cooler and use thereof

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Oberhaching, Germany

Markus Höhn