The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Jul. 12, 2006
Olaf Kurtz, Berlin, DE;
Ralph Herber, Berlin, DE;
Peter Prechtl, München, DE;
Sven Theisen, Berg, DE;
Markus Höhn, Oberhaching, DE;
Olaf Kurtz, Berlin, DE;
Ralph Herber, Berlin, DE;
Peter Prechtl, München, DE;
Sven Theisen, Berg, DE;
Markus Höhn, Oberhaching, DE;
Atotech Deutschland GmbH, Berlin, DE;
Abstract
For providing a particularly efficient micro-structured cooler intended more specifically for cooling electronic components, it is proposed to proceed in the following manner to build this cooler: providing a stack of at least two metal foils () comprising channels () for coolant and one base plate () adapted to be brought into thermal contact with the electronic component () through a thermal contact surface (), said metal foils () and said base plate () being joined together so as to form a single piece of material, said channels () having a width b ranging from 100 to 350 μm, a depth t ranging from 30 to 150 μm, a mean spacing s ranging from 30 to 300 μm, residual foil thickness r remaining after formation of the channels () in the metal foils () ranging from 30 to 300 μm and said base plate () having a thickness g ranging from 100 to 1,000 μm.