This inventor holds 2 USPTO granted patents and 2 EPO patents. Top assignee: Atotech Deutschland Gmbh. Active years: 2005-2011.
Location History:
- Munich, DE (2005)
- München, DE (2011)
Company Filing History:
Years Active: 2005-2011
Title: Innovations by Peter Prechtl in Micro-Structured Cooling Technology
Introduction
Peter Prechtl is a notable inventor based in Munich, Germany. He has made significant contributions to the field of cooling technology, particularly through his innovative designs for micro-structured coolers. With a total of 2 patents, his work focuses on enhancing the efficiency of cooling systems for electronic components.
Latest Patents
Peter Prechtl's latest patents include a "Micro-structured cooler and use thereof" and a "Microstructure cooler and use thereof." The first patent proposes a design for a highly efficient micro-structured cooler specifically intended for cooling electronic components. This invention involves a stack of at least two metal foils that contain channels for coolant, along with a base plate designed for thermal contact with the electronic component. The dimensions of the channels and the base plate are meticulously defined to optimize cooling performance. The second patent also revolves around a microstructure cooler, emphasizing the integration of metal films and a base plate to facilitate effective thermal management.
Career Highlights
Peter Prechtl is currently employed at Atotech Deutschland GmbH, where he continues to innovate in the field of cooling technologies. His work has been instrumental in advancing the efficiency of cooling systems, which is crucial for the performance and longevity of electronic devices.
Collaborations
Peter collaborates with talented coworkers such as Olaf Kurtz and Sven Theisen. Their combined expertise contributes to the development of cutting-edge cooling solutions.
Conclusion
Peter Prechtl's contributions to micro-structured cooling technology highlight his role as an influential inventor in the field. His patents reflect a commitment to improving the efficiency of cooling systems for electronic components, showcasing the importance of innovation in technology.