Mario Francesco Cortese

Title: Innovative Contributions of Mario Francesco Cortese

Introduction

Mario Francesco Cortese, an accomplished inventor based in Milan, Italy, has made significant strides in the field of microelectromechanical systems (MEMS). With a total of 15 patents to his name, his work encompasses innovative solutions that enhance acoustic transducer technology and semiconductor packaging.

Latest Patents

Among his most recent contributions, Cortese has developed a groundbreaking assembly of a capacitive acoustic transducer of the microelectromechanical type. This assembly features a first die that incorporates a MEMS sensing structure with a membrane, conducive to detecting acoustic pressure waves. The first die communicates with both a front and a back chamber, effectively creating a variable-capacitance capacitor in response to acoustic activity. The design is complemented by a second die integrating an electronic reading circuit that generates output signals corresponding to the capacitive changes.

Another significant patent involves a semiconductor package substrate intended for damage-sensitive devices. This substrate includes a core with dual surfaces covered by metal layers that define unique metal layer groups. The design ensures that a metal support zone is strategically placed beneath the device to protect it from damage while optimizing performance.

Career Highlights

Cortese's professional journey has been marked by tenures at reputable companies such as STMicroelectronics S.r.l. and STMicroelectronics (Malta) Ltd. His experience in these organizations has allowed him to focus on pioneering technologies that have the potential to revolutionize electronic devices.

Collaborations

Throughout his career, Mario has collaborated with talented individuals in the field, notably Chantal Combi and Lorenzo Baldo. Collectively, they've contributed to the advancement of MEMS technology, enhancing its applicability across various sectors.

Conclusion

Mario Francesco Cortese has established himself as a notable inventor in the realm of MEMS and semiconductor technology. His innovative patents and collaborative spirit continue to have a lasting impact on the industry, paving the way for future advancements in acoustic transducers and electronic packaging solutions.