The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2014

Filed:

Feb. 22, 2012
Applicants:

Kevin Formosa, Zabbar Malta, MT;

Mark Anthony Azzopardi, Gudja, MT;

Mario Francesco Cortese, Milan, IT;

Mark Shaw, Agrate Brianza, IT;

Alex Gritti, Vimercate, IT;

Luca Maggi, Garlate, IT;

Filippo David, Milan, IT;

Inventors:

Kevin Formosa, Zabbar Malta, MT;

Mark Anthony Azzopardi, Gudja, MT;

Mario Francesco Cortese, Milan, IT;

Mark Shaw, Agrate Brianza, IT;

Alex Gritti, Vimercate, IT;

Luca Maggi, Garlate, IT;

Filippo David, Milan, IT;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01); H04R 19/00 (2006.01); B81C 1/00 (2006.01); H04R 9/08 (2006.01); H04R 11/04 (2006.01); H04R 17/02 (2006.01); H04R 19/04 (2006.01); H04R 21/02 (2006.01);
U.S. Cl.
CPC ...
H04R 19/005 (2013.01); B81B 2207/07 (2013.01); B81C 2203/0792 (2013.01); H01L 2224/48091 (2013.01); B81C 2203/035 (2013.01); B81B 2207/093 (2013.01); B81B 2207/012 (2013.01); B81C 1/0023 (2013.01); B81C 2203/0785 (2013.01); B81B 2201/0257 (2013.01); H01L 2224/48137 (2013.01); B81C 2203/019 (2013.01); H01L 2924/10253 (2013.01);
Abstract

A MEMS transducer has a micromechanical sensing structure and a package. The package is provided with a substrate, carrying first electrical-connection elements, and with a lid, coupled to the substrate to define an internal cavity, in which the micromechanical sensing structure is housed. The lid is formed by: a cap layer having a first surface and a second surface, set opposite to one another, the first surface defining an external face of the package and the second surface facing the substrate inside the package; and a wall structure, set between the cap layer and the substrate, and having a coupling face coupled to the substrate. At least a first electrical component is coupled to the second surface of the cap layer, inside the package, and the coupling face of the wall structure carries second electrical-connection elements, electrically connected to the first electrical component and to the first electrical-connection elements.


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