The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2014

Filed:

May. 31, 2013
Applicant:

Stmicroelectronics S.r.i., Agrate Brianza, IT;

Inventors:

Lorenzo Baldo, Bareggio, IT;

Chantal Combi, Oggiono, IT;

Mario Francesco Cortese, Milan, IT;

Assignee:

STMicroelectronics S.r.l., Agrate Brianza (MB), IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); G01L 19/14 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0061 (2013.01); G01L 19/147 (2013.01); H01L 2224/48247 (2013.01); B81B 2201/0257 (2013.01); B81C 2203/0154 (2013.01); G01L 19/148 (2013.01); B81B 2201/0264 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/10253 (2013.01); G01L 19/141 (2013.01);
Abstract

Electronic device including a substrate provided with at least one passing opening, a MEMS device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the MEMS device leaves the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate.


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