Chandler, AZ, United States of America

Manohar S Konchady

USPTO Granted Patents = 6 

Average Co-Inventor Count = 4.5

ph-index = 3

Forward Citations = 24(Granted Patents)


Company Filing History:


Years Active: 2014-2022

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6 patents (USPTO):Explore Patents

Title: Manohar S Konchady: Innovator in Coreless Package Substrate Technology

Introduction

Manohar S Konchady is a prominent inventor based in Chandler, AZ (US). He has made significant contributions to the field of electronics packaging, particularly in the development of coreless package substrates. With a total of 6 patents to his name, his work has been instrumental in advancing packaging technologies.

Latest Patents

Konchady's latest patents focus on methods of forming a package substrate. One of his notable inventions is a coreless package substrate with dual side solder resist layers. This innovative substrate features a top side and a bottom side, which includes a single build-up structure made of at least one insulating layer, at least one via, and at least one conductive layer. The design incorporates a bottom plurality of contact pads on the bottom side and a top plurality of contact pads on the top side. Additionally, it includes a bottom solder resist layer on the bottom side and a top solder resist layer on the top side. The concept of dual side solder resist is extended to packages with interconnect bridges with C4 interconnection pitch over a wide range.

Career Highlights

Konchady is currently employed at Intel Corporation, where he continues to push the boundaries of packaging technology. His work has not only contributed to the company's innovations but has also set new standards in the industry.

Collaborations

Throughout his career, Konchady has collaborated with talented individuals such as Mihir K Roy and Tao Wu. These collaborations have fostered a creative environment that has led to groundbreaking advancements in packaging technology.

Conclusion

Manohar S Konchady is a key figure in the field of coreless package substrate technology. His innovative patents and contributions at Intel Corporation highlight his commitment to advancing electronic packaging solutions. His work continues to influence the industry and pave the way for future innovations.

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