The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
May. 29, 2013
Applicants:
Manohar S. Konchady, Chandler, AZ (US);
Mihir K. Roy, Chandler, AZ (US);
Inventors:
Manohar S. Konchady, Chandler, AZ (US);
Mihir K. Roy, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/10 (2006.01); H01L 23/34 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01);
Abstract
The subject matter of the present application relates to a heat dissipation device that is embedded within a microelectronic die. The heat dissipation device may be fabricated by forming at least one trench extending into the microelectronic die from a microelectronic die back surface, which opposes an active surface thereof, and filling the trenches with at least one layer of thermally conductive material. In one embodiment, the heat dissipation device may be a thermoelectric cooling device.