Manfred Wossler

Title: Manfred Wossler: Innovator in Electronic Components

Introduction

Manfred Wossler is a notable inventor based in Munich, Germany. He has made significant contributions to the field of electronic components, holding a total of 6 patents. His work primarily focuses on the development of advanced semiconductor technologies.

Latest Patents

Wossler's latest patents include an electronic chip component with an integrated circuit and a fabrication method. This invention relates to a semiconductor chip that features an integrated circuit, with contact surfaces located on the active surface of the chip. The contact surfaces consist of a pressure contact material that extends beyond the top non-conductive layer. Additionally, the active surface includes a meltable glue layer tailored to the height of the contact layer. Another significant patent is for a surface acoustic wave component. This electronic component comprises a piezoelectric substrate with conductive structures and a base plate with external electrical terminal elements. A protective film is applied to the chip surface, which carries electrical contact elements connected to the conductive structures and terminal elements.

Career Highlights

Throughout his career, Wossler has worked with prominent companies such as Siemens Aktiengesellschaft and Epcos AG. His experience in these organizations has allowed him to refine his expertise in electronic component design and fabrication.

Collaborations

Wossler has collaborated with notable colleagues, including Karl Weidner and Hans-Juergen Hacke. These partnerships have contributed to the advancement of his innovative projects.

Conclusion

Manfred Wossler's contributions to the field of electronic components demonstrate his commitment to innovation and technology. His patents reflect a deep understanding of semiconductor design, which continues to influence the industry.