Siemens Aktiengesellschaft

Epcos Ag

Infineon Technologies Ag

Manfred Wossler

Karl Weidner

Alois Stelzl

Hans Kr&uuml;ger

Hans-Juergen Hacke

Wolfgang Radlik

Hans-Jürgen Hacke

The invention relates to an electronic chip component and a method for fabricating the chip component with a semiconductor chip having an integrated circuit therein. Contact surfaces are on the active surface of the semiconductor chip. The contact surfaces of the integrated circuit have a contact layer consisting of pressure contact material, which protrudes beyond the level of the top non-conductive layer. The active surface of the semiconductor chip includes a meltable glue layer that is adapted to the height of the contact layer.

Electronic chip component with an integrated circuit and fabrication method

An electronic component such as a surface acoustic wave component has a chip a piezoelectric substrate with electrically conductive structures thereon and a base plate having external electrical terminal elements that are contacted to the electrically conductive structures of the chip. A protective film is applied onto the chip surface carrying the electrically conductive structures. The surface of the protective film facing away from the piezoelectric substrate carries electrical contact elements that are connected, to the electrically conductive structures of the chip via through-contacts in the protective film and/or directly via bumps, as well as to the electrical terminal elements of the base plate.

Surface acoustic wave component

The multiple blank can be diced into individual blanks for electronic components, in particular surface acoustic wave components. Each of the individual blanks is suitable for contact to be made with chips in the flip-chip technique and for contact to be made with the individual blanks in the SMD technique, using external connections. The multiple blank has, for each individual blank, metalized areas which are located on a network which is integrated between layers of the multiple blank and leads to a connecting terminal. Bumps are built up by depositing metal by electroplating on the metalized areas.

Multiple blank for electronic components such as SAW components, and method of building up bumps, solder frames, spacers and the like

The transformation of An IC substrate with edge contacts into a ball grid array is accomplished using a flexible circuit that has terminals arranged planarly on the underside for receiving meltable solder humps and whose conductors leading outwardly from the terminals have exposed ends. The upper side of the flexible circuit is connected with the lower side of the substrate, whereupon the edge regions of the flexible circuit are bent up and around the substrate and the ends of the conductors are electrically contacted to the edge contacts of the substrate.

Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array

Method for transforming a substrate with edge contacts into a ball grid array

A system is disclosed for picking up, depositing and transporting thin foils by use of a vacuum lifting device. The vacuum lifting device is conveyed on a traverse from a foil receiving station to a foil depositing station. At the depositing station a transport frame is provided on guide rails to permit conveyance to a processing station. At the receiving station the vacuum lifting device picks up the foil by suction at a central region of the foil such that the foil will be suspended in a curved fashion from the vacuum lifting device. At the depositing station, the vacuum lifting device is lowered so as to permit ends of the foil which are downwardly extending on both sides of the vacuum lifting device to be pushed beneath open foil clamps on the transport frame. Subsequently the clamps are closed and the foil is maintained in an extended, wrinkle free arrangement for conveyance to the processing station.

Growing community of inventors

Munich, Germany

Manfred Wossler