The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2005
Filed:
Jan. 17, 2003
Applicants:
Hans-jürgen Hacke, München, DE;
Manfred Wossler, München, DE;
Inventors:
Hans-Jürgen Hacke, München, DE;
Manfred Wossler, München, DE;
Assignee:
Infineon Technologies AG, Munich, DE;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L023/48 ; H01L023/52 ; H01L029/40 ;
U.S. Cl.
CPC ...
Abstract
The invention relates to an electronic chip component and a method for fabricating the chip component with a semiconductor chip having an integrated circuit therein. Contact surfaces are on the active surface of the semiconductor chip. The contact surfaces of the integrated circuit have a contact layer consisting of pressure contact material, which protrudes beyond the level of the top non-conductive layer. The active surface of the semiconductor chip includes a meltable glue layer that is adapted to the height of the contact layer.