The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2003
Filed:
Apr. 30, 2001
Applicant:
Inventors:
Hans-Juergen Hacke, Munich, DE;
Manfred Wossler, Munich, DE;
Karl Weidner, Munich, DE;
Wolfgang Radlik, Munich, DE;
Assignee:
Siemens Aktiengesellschaft, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 ; H05K 1/16 ;
U.S. Cl.
CPC ...
H05K 1/00 ; H05K 1/16 ;
Abstract
The transformation of An IC substrate with edge contacts into a ball grid array is accomplished using a flexible circuit that has terminals arranged planarly on the underside for receiving meltable solder humps and whose conductors leading outwardly from the terminals have exposed ends. The upper side of the flexible circuit is connected with the lower side of the substrate, whereupon the edge regions of the flexible circuit are bent up and around the substrate and the ends of the conductors are electrically contacted to the edge contacts of the substrate.