This inventor holds 3 USPTO granted patents. Top assignees: Siemens Aktiengesellschaft, Infineon Technologies Ag. Active years: 2001-2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2001-2003
Title: Wolfgang Radlik: Innovator in Metallization and Flexible Wiring
Introduction
Wolfgang Radlik is a notable inventor based in Munich, Germany. He has made significant contributions to the field of electrical engineering, particularly in the areas of metallization methods and flexible wiring technologies. With a total of 3 patents to his name, Radlik's work has had a considerable impact on the industry.
Latest Patents
One of Radlik's latest patents is a metallizing method for dielectrics. This innovative method involves applying a photosensitive dielectric to a substrate, exposing it to light through a mask, seeding it with metal, and subjecting it to temperature treatment. The dielectric is then chemically metallized. Alternatively, the dielectric can be seeded with metal after application to the substrate, followed by exposure to light through a mask. Excess seeding material is removed before the dielectric undergoes chemical metallization.
Another significant patent is related to flexible wiring for transforming a substrate with edge contacts into a ball grid array. This transformation is achieved using a flexible circuit that has terminals arranged planarly on the underside for receiving meltable solder humps. The conductors leading outwardly from the terminals have exposed ends. The upper side of the flexible circuit is connected to the lower side of the substrate, allowing the edge regions of the flexible circuit to be bent up and around the substrate, with the ends of the conductors electrically contacting the edge contacts of the substrate.
Career Highlights
Throughout his career, Wolfgang Radlik has worked with prominent companies such as Siemens and Infineon Technologies. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in technology.
Collaborations
Radlik has collaborated with notable colleagues, including Hans-Juergen Hacke and Manfred Wossler. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.
Conclusion
Wolfgang Radlik's contributions to the fields of metallization and flexible wiring demonstrate his innovative spirit and technical expertise. His patents reflect a commitment to advancing technology and improving electrical engineering practices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

