Siemens Aktiengesellschaft

Infineon Technologies Ag

Wolfgang Radlik

Karl Weidner

Manfred Wossler

Hans-Juergen Hacke

Recai Sezi

Guenter Schmid

Klaus Lowack

Joerg Haussmann

A method for metallizing dielectrics includes applying a photosensitive dielectric to a substrate. The dielectric is then exposed to light through a mask, is seeded with a metal and is subjected to a temperature treatment. Afterwards, the dielectric is chemically metallized. Alternatively, the dielectric can be first be seeded with a metal after being applied to the substrate, and can then be exposed to light through a mask. Afterwards, excess seeding material is removed and the dielectric is chemically metallized.

Metallizing method for dielectrics

The transformation of An IC substrate with edge contacts into a ball grid array is accomplished using a flexible circuit that has terminals arranged planarly on the underside for receiving meltable solder humps and whose conductors leading outwardly from the terminals have exposed ends. The upper side of the flexible circuit is connected with the lower side of the substrate, whereupon the edge regions of the flexible circuit are bent up and around the substrate and the ends of the conductors are electrically contacted to the edge contacts of the substrate.

Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array

Method for transforming a substrate with edge contacts into a ball grid array

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Munich, Germany

Wolfgang Radlik