Nagano, Japan

Mamoru Okada

This inventor holds 3 USPTO granted patents. Top assignee: Shin-Etsu Handotai Co., Ltd.. Active years: 2001-2009.


% Patents Active = 66.7

Average Co-Inventor Count = 3.2

ph-index = 3

Forward Citations = 46(Granted Patents)


Location History:

  • Nagano-ken, JP (2001)
  • Nagano, JP (2005 - 2009)

Company Filing History:


Years Active: 2001-2009

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3 patents (USPTO):Explore Patents

Title: Mamoru Okada: Innovator in Semiconductor Wafer Production

Introduction

Mamoru Okada is a distinguished inventor based in Nagano, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the production of semiconductor wafers. With a total of 3 patents to his name, Okada's work has advanced the efficiency and quality of semiconductor manufacturing processes.

Latest Patents

Okada's latest patents include a method for producing semiconductor wafers and a semiconductor wafer itself. The first patent outlines a comprehensive method that includes a double-side polishing step and a chamfered-portion polishing step. This innovative approach ensures that scratches generated during the polishing process are removed, while also preventing excessive polishing in the peripheral portion of the main surface. As a result, the method produces semiconductor wafers with high flatness, even near the chamfered portions.

The second patent focuses on a method for thinning semiconductor wafers by grinding the back surface of the wafer, which has semiconductor devices formed on its surface. This method allows for the production of wafers with a thickness of about 120 µm or less, minimizing breakage during processing. The use of a thermal release double-sided adhesive sheet as the adhesive layer further enhances the efficiency of the thinning process.

Career Highlights

Mamoru Okada is currently employed at Shin-Etsu Handotai Co., Ltd., a leading company in the semiconductor industry. His work at this organization has been pivotal in driving innovations that improve semiconductor wafer production techniques.

Collaborations

Okada has collaborated with notable colleagues, including Yukio Nakajima and Hisashi Kijima. Their combined expertise has contributed to the advancement of semiconductor technologies and the successful implementation of innovative production methods.

Conclusion

Mamoru Okada's contributions to semiconductor wafer production exemplify the impact of innovation in technology. His patents reflect a commitment to enhancing manufacturing processes, ensuring high-quality outcomes in the semiconductor industry.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
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