This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Disco Corporation. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: Mai Haneda - Innovator in Grinding Mechanism Technology
Introduction
Mai Haneda is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of grinding mechanisms, particularly in the semiconductor industry. His innovative approach has led to the development of a unique setup method that enhances the efficiency of grinding processes.
Latest Patents
Mai Haneda holds 1 patent for his invention titled "Setup method." This patent describes a method for determining the height of a grinding mechanism when the lower surfaces of grinding stones come into contact with the upper surface of a wafer. The process involves lowering the grinding mechanism from above the wafer and determining an origin point height based on this interaction.
Career Highlights
Mai Haneda is currently employed at Disco Corporation, a leading company in the semiconductor manufacturing equipment sector. His work at Disco Corporation has allowed him to focus on advancing grinding technology, which is crucial for the production of high-quality semiconductor devices.
Collaborations
Throughout his career, Mai has collaborated with talented individuals such as Takenobu Mori and Atsushi Takagi. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Mai Haneda's contributions to grinding mechanism technology exemplify the spirit of innovation in the semiconductor industry. His patent and work at Disco Corporation highlight his commitment to advancing technology and improving manufacturing processes.