This inventor holds 3 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2004-2011.
Location History:
- Chandler, AZ (US) (2004 - 2005)
- Gilbert, AZ (US) (2011)
Company Filing History:
Years Active: 2004-2011
Title: Mahadevan Survakumar: Innovator in Microelectronic Packaging
Introduction
Mahadevan Survakumar is a notable inventor based in Chandler, AZ (US), recognized for his contributions to the field of microelectronics. With a total of 3 patents, he has made significant advancements in microelectronic packaging technologies.
Latest Patents
Survakumar's latest patents include innovative designs and methods that enhance the performance of microelectronic packages. One of his patents, titled "Microelectronic package and method of manufacturing same," describes a microelectronic package that features a first substrate with interconnects of varying pitches, allowing for efficient coupling with a second substrate. This design optimizes the surface area and interconnects to improve functionality. Another patent, "Package structure with increased capacitance and method," outlines a package that incorporates a core with dielectric properties and multiple buildup layers. The unique design of the buildup layers, which includes offset ablated regions, increases capacitance, enabling processors to operate at higher data rates and draw more current.
Career Highlights
Survakumar is currently employed at Intel Corporation, where he continues to push the boundaries of microelectronic technology. His work has been instrumental in developing advanced packaging solutions that meet the demands of modern electronic devices.
Collaborations
Throughout his career, Survakumar has collaborated with esteemed colleagues, including John Stephen Guzek and Hamid Azimi. These partnerships have fostered innovation and contributed to the success of various projects within the microelectronics sector.
Conclusion
Mahadevan Survakumar's contributions to microelectronic packaging demonstrate his expertise and commitment to innovation. His patents reflect a deep understanding of the complexities involved in microelectronic design, positioning him as a key figure in the industry.