Intel Corporation

Mahadevan Survakumar

John Stephen Guzek

Hamid Azimi

A microelectronic package includes a first substrate () having a first surface area () and a second substrate () having a second surface area (). The first substrate includes a first set of interconnects () having a first pitch () at a first surface () and a second set of interconnects () having a second pitch () at a second surface (). The second substrate is coupled to the first substrate using the second set of interconnects and includes a third set of interconnects () having a third pitch () and internal electrically conductive layers () connected to each other with a microvia (). The first pitch is smaller than the second pitch, the second pitch is smaller than the third pitch, and the first surface area is smaller than the second surface area.

Microelectronic package and method of manufacturing same

A package with increased capacitance comprises a core and a plurality of buildup layers. The core has an inner dielectric portion and the core outer conductive layer. The buildup layers are disposed over the core and have offset ablated regions reducing the thickness of the buildup layers in the ablated regions. Conductive material is plated on the buildup layers including within the ablated regions. The reduced thickness and increased plate area due to the ablated regions increases the capacitance between adjacent buildup layers. Processors and processing systems may take advantage of the increased capacitance in the package to draw more current and operate at higher data rates.

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Chandler, AZ, United States of America

Mahadevan Survakumar