The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2005
Filed:
May. 28, 2004
Mahadevan Survakumar, Chandler, AZ (US);
Mahadevan Survakumar, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A package with increased capacitance comprises a core and a plurality of buildup layers. The core has an inner dielectric portion and the core outer conductive layer. The buildup layers are disposed over the core and have offset ablated regions reducing the thickness of the buildup layers in the ablated regions. Conductive material is plated on the buildup layers including within the ablated regions. The reduced thickness and increased plate area due to the ablated regions increases the capacitance between adjacent buildup layers. Processors and processing systems may take advantage of the increased capacitance in the package to draw more current and operate at higher data rates.