Company Filing History:
Years Active: 2005
Title: Ma Chia-Chih: Innovator in HDP Oxide Deposition Removal
Introduction
Ma Chia-Chih, based in Hsinchu, Taiwan, is a notable inventor recognized for his contributions to semiconductor manufacturing. His innovative approach to the removal of High-Density Plasma (HDP) oxide deposition has significant implications for the efficiency and quality of semiconductor devices.
Latest Patents
Ma Chia-Chih holds a patent for a method of removing HDP oxide deposition. This patent outlines a systematic approach that includes etching the HDP oxide deposition using an in-side-out model, where the etching rate in the center of the substrate is faster than at the edges. Following that, an out-side-in model is employed, allowing for a faster etching rate at the edges compared to the center. The process concludes with the removal of any remaining silicon oxide layer through chemical-mechanical polishing (CMP). This method ensures a more uniform planarization of the HDP oxide deposition, enhancing the overall performance of semiconductor components.
Career Highlights
Ma Chia-Chih is affiliated with Macronix International Co., Ltd., where he collaborates with fellow innovators to drive advancements in semiconductor technology. His unique patent reflects his deep understanding of the intricacies involved in the semiconductor fabrication process.
Collaborations
Throughout his career, Ma has partnered with talented colleagues such as H Wally Lee and Ching-Ping Wu. These collaborations foster an environment of innovation, leading to significant advancements in the field and contributing to the success of the projects they undertake.
Conclusion
Ma Chia-Chih's contributions to the semiconductor industry demonstrate the vital role of innovation in technological advancement. His patented method for removing HDP oxide deposition not only improves manufacturing processes but also sets a precedent for future developments within the sector. His ongoing work at Macronix International Co., Ltd. continues to enhance the capabilities and efficiencies of semiconductor fabrication.