Zurich, Switzerland

Lorenzo Rocchino

This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: International Business Machines Corporation. Active years: 2025-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lorenzo Rocchino. Retrieved from https://idiyas.com/inventor/lorenzo-rocchino

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2025-2026

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2 patents (USPTO):Explore Patents

Title: Lorenzo Rocchino: Innovator in Integrated Circuit Technology

Introduction

Lorenzo Rocchino is a prominent inventor based in Zurich, Switzerland. He has made significant contributions to the field of integrated circuit technology. His innovative work focuses on the development of advanced interconnects made from layered topological materials.

Latest Patents

Rocchino holds a patent for an integrated circuit device with interconnects made of layered topological materials. This patent describes an integrated circuit device that comprises one or more interconnects. Each interconnect can be structured as a stack of layers, including distinct topological layers. These layers are engineered to preserve topologically protected surface states, enhancing the performance and reliability of integrated circuits.

Career Highlights

Lorenzo Rocchino is associated with International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to explore cutting-edge technologies and contribute to advancements in integrated circuit design.

Collaborations

Rocchino has collaborated with notable colleagues, including Bernd W Gotsmann and Bogdan Cezar Zota. These collaborations have fostered innovation and have been instrumental in the development of new technologies in the field.

Conclusion

Lorenzo Rocchino is a key figure in the realm of integrated circuit technology, with a focus on topological materials. His contributions through patents and collaborations continue to shape the future of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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