International Business Machines Corporation

Lorenzo Rocchino

Bogdan Cezar Zota

Alan Molinari

Described is an integrated circuit device comprising one or more interconnects. Each interconnect of the one or more interconnects can be structured as a stack of layers including distinct topological layers, where each of the distinct topological layers can be a layer of topological material. Any two successive layers of the distinct topological layers can be separated by one or more interfaces, each forming a boundary between two consecutive layers of the stack, where the two consecutive layers can be engineered to preserve topologically protected surface states of each of the any two successive layers of the distinct topological layers.

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Zurich, Switzerland

Lorenzo Rocchino