Singapore, Singapore

Liu Lianjun

This inventor holds 2 USPTO granted patents. Top assignee: Chartered Semiconductor Manufacturing Ltd (Corporation). Active years: 1995-1996.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Liu Lianjun. Retrieved from https://idiyas.com/inventor/liu-lianjun

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 44(Granted Patents)


Company Filing History:


Years Active: 1995-1996

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Liu Lianjun: Innovator in Metal Etching Processes

Introduction

Liu Lianjun is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor manufacturing. He holds 2 patents that showcase his innovative approaches to metal etching processes. His work has significantly impacted the efficiency and effectiveness of semiconductor fabrication.

Latest Patents

Liu's latest patents include an "Enhanced Metal Etch Process" and a "Method of Beveled Contact Opening Formation." The Enhanced Metal Etch Process describes a method for dry etching metal films, specifically aluminum. This process utilizes photoresist as a mask along with a gas mixture of BCl3, Cl2, and N2 for reactive ion etching (RIE). The introduction of specific amounts of N2 into the etching chemistry results in non-tapered aluminum shapes, which are achieved by creating a protective polymer on the sidewalls during the etching procedure. This innovation helps to mitigate the isotropic components of the RIE process that typically cause tapering. Additionally, this RIE process can be conducted at elevated temperatures to avoid microloading effects.

The second patent, the Method of Beveled Contact Opening Formation, provides a technique for forming contact and via holes in interlevel dielectrics that ensure good metal step coverage. This method employs isotropic etching, anisotropic etching, and argon sputter etching in a vacuum, eliminating the need for high-temperature contact reflow. The final argon sputter etch is a timed process that smooths sharp edges, exposes regions for electrical contact, and planarizes the interlevel dielectric.

Career Highlights

Liu Lianjun is currently employed at Chartered Semiconductor Manufacturing Ltd, where he applies his expertise in semiconductor processes. His innovative work has contributed to advancements in the industry, enhancing the performance and reliability of semiconductor devices.

Collaborations

Liu has collaborated with notable colleagues, including Teo Y Meng and Ron-Fu Chu, who have contributed to his research and development efforts in the semiconductor field.

Conclusion

Liu Lianjun's contributions to metal etching processes have established him as a significant figure in semiconductor manufacturing. His innovative patents reflect his commitment to advancing technology in this critical industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…