Lien-Chi Chan

Title: Lien-Chi Chan: Innovator in Semiconductor Technology

Introduction

Lien-Chi Chan is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on improving the design and functionality of semiconductor packages, which are essential components in modern electronic devices.

Latest Patents

One of Lien-Chi Chan's latest patents is a semiconductor package with a lead frame as a chip carrier and a method for fabricating the same. This innovative design includes a lead frame that features a die pad and multiple leads spaced apart from the die pad. Each lead consists of an inner lead portion directed toward the die pad and an outer lead portion with a terminal. The design allows for at least one chip to be mounted on the die pad, with a first encapsulant formed to encapsulate the chip, die pad, and inner lead portions. A second encapsulant, created through injection molding, encapsulates the first encapsulant and outer lead portions while exposing the terminals of the outer lead portions. This method effectively prevents resin flash over the exposed terminals, ensuring the electrical connection quality of the semiconductor package.

Career Highlights

Lien-Chi Chan is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His expertise and innovative designs have contributed to the company's reputation for high-quality semiconductor solutions.

Collaborations

Some of Lien-Chi Chan's notable coworkers include Jui-Yu Chuang and Chih-Ming Huang, who collaborate with him on various projects within the company.

Conclusion

Lien-Chi Chan's contributions to semiconductor technology through his patents and work at Siliconware Precision Industries Co., Ltd. highlight his role as an influential inventor in the industry. His innovative designs continue to shape the future of electronic components.