The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2003
Filed:
Sep. 05, 2001
Chien-Ping Huang, Hsichu, TW;
Chi-Chuan Wu, Taichung, TW;
Jui-Yu Chuang, Taichung, TW;
Lien-Chi Chan, Taichung, TW;
Abstract
A heat sink with a collapse structure and a semiconductor device with the heat sink are proposed, in which the heat sink is in ladder-like shape due to a height difference formed between an extending portion and an body of the heat sink, and the body has at least one surface exposed to outside of the semiconductor package. The extending portion produces collapse deformation in response to stress from engagement of molds in a molding process, so as to prevent a semiconductor chip from being damaged by the stress. The heat sink directly attached to the chip allows heat generated by the chip to pass through the extending portion to the body of the heat sink, and then the heat can be dissipated through the exposed surface of the body to the outside of the semiconductor package, so as to improve the heat dissipating efficiency.