Taipei, Taiwan

Liang Szuma

This inventor holds 6 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 1998-2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Liang Szuma. Retrieved from https://idiyas.com/inventor/liang-szuma

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 32(Granted Patents)


Location History:

  • Taipei, TW (1998 - 2001)
  • Hsin-Chu, TW (2001)

Company Filing History:


Years Active: 1998-2001

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6 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Inventor Liang Szuma in Semiconductor Technology

Introduction

Liang Szuma is a renowned inventor based in Taipei, Taiwan, with a remarkable portfolio of six patents. His work primarily focuses on advancements in semiconductor technology, particularly in methods that enhance the fabrication and functionality of integrated circuits.

Latest Patents

Two of Liang Szuma's latest patents showcase his ingenuity and cutting-edge approach to problem-solving in the semiconductor industry:

1. **Use of WEE (Wafer Edge Exposure) to Prevent Polyimide** - This patent discloses a method for sealing the edge of a wafer against contaminants and debris during the grinding and backlapping of semiconductor substrates. By utilizing a photosensitive polyimide as a dielectric material, Liang's method employs a light source positioned near the wafer's edge. This process ensures that only specific areas of the polyimide are fixed in place, forming “scribe channels” and sealing the edges to prevent polishing contaminants from entering.

2. **Method to Prevent Delamination of Spin-On-Glass and Plasma Nitride Layers Using Ion Implantation** - In this innovative method, Liang implements ion implantation to improve the adhesion between plasma nitride and spin-on-glass layers in integrated circuit devices. By forming an amorphous, silicon-rich adhesion layer at the top surface of the spin-on-glass layer, he enhances the connection between various semiconductor layers, ultimately leading to more durable and efficient integrated circuits.

Career Highlights

Liang Szuma currently works at Taiwan Semiconductor Manufacturing Company Ltd. His contributions have significantly impacted developments within semiconductor processing techniques, underscoring his role as an influential figure in the field. Through his patents, Liang continues to pioneer innovative methodologies that enhance semiconductor device reliability and performance.

Collaborations

Throughout his career, Liang has worked alongside esteemed colleagues, including Hsiang Sheng Liu and Chien-Ming Chung. These collaborations have fostered an environment of dynamic innovation, propelling forward the advancement of semiconductor technologies.

Conclusion

Liang Szuma stands out as a pivotal inventor whose innovative approaches to semiconductor manufacturing contribute to the ongoing evolution of integrated circuits. With six patents to his name, his work not only exemplifies technical prowess but also represents a significant step forward in the semiconductor industry, paving the way for more efficient and reliable electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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