This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2017-2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Zhubei, TW (2017)
- Hsinchu, TW (2022)
Company Filing History:
Years Active: 2017-2025
Title: Innovations by Liang-Ju Yen in Semiconductor Technology
Introduction
Liang-Ju Yen is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on advanced semiconductor packaging solutions that enhance performance and efficiency.
Latest Patents
Liang-Ju Yen's latest patents include innovative designs for 3D semiconductor packages. One of his patents describes a semiconductor package that consists of a first die, a first heat conduction block, and a first encapsulant. This design features a bottom surface, a top surface, and a sidewall for the first die, with the heat conduction block similarly structured. The encapsulant is strategically placed between the sidewalls of the die and the heat conduction block. Another patent details a semiconductor package that includes a substrate and a package structure. This structure is bonded to the substrate and comprises a first redistribution layer structure, a first logic die, multiple second logic dies, a first memory die, a first heat conduction block, and a first encapsulant. The configuration allows for efficient electrical connections and thermal management.
Career Highlights
Liang-Ju Yen is currently employed at Taiwan Semiconductor Manufacturing Company Ltd., a leading firm in the semiconductor industry. His role involves developing cutting-edge packaging technologies that are crucial for modern electronic devices. His expertise in semiconductor design has positioned him as a key player in the field.
Collaborations
Throughout his career, Liang-Ju Yen has collaborated with notable colleagues, including Kuo-Chung Yee and Chen-Hua Douglas Yu. These partnerships have fostered innovation and contributed to the advancement of semiconductor technologies.
Conclusion
Liang-Ju Yen's contributions to semiconductor packaging are noteworthy and reflect his commitment to innovation in technology. His patents demonstrate a deep understanding of the complexities involved in semiconductor design and manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile