Kaohsiung, Taiwan

Li Chuan Tsai

This inventor holds 5 USPTO granted patents and 1 published patent application. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2018-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Li Chuan Tsai. Retrieved from https://idiyas.com/inventor/li-chuan-tsai-uvhyp5u8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 100.0

Average Co-Inventor Count = 2.6

ph-index = 2

Forward Citations = 50(Granted Patents)


Company Filing History:


Years Active: 2018-2020

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5 patents (USPTO):Explore Patents

Title: The Innovations of Li Chuan Tsai

Introduction

Li Chuan Tsai is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on enhancing semiconductor substrates and packaging devices, which are crucial for modern electronic applications.

Latest Patents

Among his latest patents is a groundbreaking invention titled "Semiconductor substrate including embedded component and method of manufacturing the same." This patent describes a semiconductor substrate that features a multi-layered structure, which includes a component and a first conductive via. The multi-layered structure consists of several dielectric layers and patterned conductive layers, with the topmost patterned conductive layer embedded in the topmost dielectric layer. The component is integrated within this structure, and the first conductive via establishes an electrical connection between the component and one of the patterned conductive layers.

Another notable patent is "Semiconductor substrate and semiconductor packaging device, and method for forming the same." This invention outlines a semiconductor substrate that comprises a first dielectric layer and a first patterned conductive layer. A second dielectric layer is placed on top of the first, and a first bump pad is included in the second dielectric layer. This bump pad is electrically connected to the first patterned conductive layer and features a curved surface surrounded by the second dielectric layer.

Career Highlights

Li Chuan Tsai is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in the semiconductor field. His work has been instrumental in advancing the technology used in semiconductor manufacturing and packaging.

Collaborations

Throughout his career, Li has collaborated with several talented individuals, including Chih-Cheng Lee and Chih Cheng Lee, who contribute to the innovative environment at Advanced Semiconductor Engineering, Inc.

Conclusion

Li Chuan Tsai's contributions to semiconductor technology through his patents and work at Advanced Semiconductor Engineering, Inc. highlight his role as a key innovator in the industry. His inventions are paving the way for advancements in electronic devices and applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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